Custom Sputter & E-Beam Deposition
• The system is currently configured to evaporate gold, titanium or chromium onto 4" substrates.
• Piece parts can also be coated by the use of spring clips to the 4" carrier.
• The tool is equipped with a thickness monitor for thickness control.
• Deposition rates are of the order of 2 A/sec.
• Typically used for the evaporation of gold contacts on silicon wafers.